AX8100 is a high-resolution X-ray equipment manufactured by UFJ for detecting welding defects of electronic components such as BGA, CSP, flip chip, semiconductor, etc.; it is also suitable for SMTA process, production process monitoring and BGA rework inspection.
AX8100 is a high-resolution X-ray equipment manufactured by UFJ for detecting welding defects of electronic components such as BGA, CSP, flip chip, semiconductor, etc.; it is also suitable for SMTA process, production process monitoring and BGA rework inspection.