SPI 3D Solder paste thickness tester

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SPI 3D Solder paste thickness tester

SPI PARMI HS60

Performance characteristics：

Price: Negotiable (available for rent or sale)

Brand: PARMI SPI

Model: SPI HS60

Detection principle: Laser laser detection solder paste configuration: all solder paste/tin or Wuxi detection substrate configuration: all colors & all pads offline programming: Gerberworks SPC&


Product details

Project monitoring: SPCworks

System diagnosis: SPImanager

Scan resolution: 20μm

Side resolution: 18μm

High resolution: 0.2μm

Solder paste height: 1000μm

Solder paste size: 20X20mm

Minimum solder paste size: 200X200μm

Minimum solder paste pitch (Pitch): 150μm

Rated power: 2.5kw

Voltage: 220v

Resolution frequency: 50/60Hz

Measurement: Camera system: High frame rate C-MOS sensor, 18X18μm pixel resolution


Success case

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