3D SPI

TR7007 SII

性能特点:

TR7007SII /TR7007SIIPLUS 3D SPI 九成新

德律TR7007SII介绍:

TR7007 SII是产业最快速的锡膏印刷检测机,检测速度高达200 cm2/sec。高精度在线型无阴影的锡膏印刷检测解决方案提供全3D检测,分辨率包含15 µm or 10 µm并具备高精度线型马达平台。此系统的特点包括closed loop function、强化的2D成像技术、自动板弯补偿功能与条纹光扫描技术。此系列亦有双轨架构之机型,在不增加机台落地空间下,大幅提升了生产线的产能。

德律TR7007SII特性:

1. 业界最快速的锡膏印刷检测机

2. 无阴影条纹光检测技术

3.光学分辨率提供10 µm 及 15 µm 两种选择

4. X-Y table线性马达可提供无震动精确检测

德律TR7007SII规格:

Optical System

Imaging MethodDynamic Imaging
Camera4 Mpix
Imaging Resolution10 µm or 15 µm (factory setting)
LightingRGB LED
3D Technology2-way Digital Fringe Pattern
Field of View4 Mpix@ 10 µm: 20 x 20 mm
4 Mpix@ 15 µm: 30 x 30 mm

Inspection Performance

Imaging Speed4 Mpix@ 10 µm: 90 cm²/sec
4 Mpix@ 15 µm: 200 cm²/sec
Height Resolution0.4 µm
Max. Solder Height@ 10 µm: 420 µm
@ 15 µm: 385 µm

Motion Table & Control

X-Axis ControlLinear Motor and linear scale with DSP-based controller
Y-Axis ControlBallscrew + AC-servo controller
Z-Axis ControlBallscrew + AC-servo controller
X-Y Axis Resolution0.5 µm
Z-Axis Resolution1 µm

Board Handling

Max PCB SizeTR7007 SII: 510 x 460 mm*
TR7007L SII: 660 x 610 mm
TR7007LL SII: 850 x 610 mm
TR7007 SII DUAL LANE: 510 x 310 mm

*Board Size TR7007L SII: 50 x 50 - 660 x 610 mm (1.97 x 1.97 - 26.0 x 24.0 in) [optional]
TR7007LL SII: 50 x 50 - 850 x 610 mm (1.97 x 1.97 - 33.5 x 24.0 in) [optional]
PCB Thickness0.6-5 mm
Max PCB WeightTR7007 SII: 3 kg
TR7007L SII: 5 kg
TR7007LL SII: 5 kg
TR7007 SII DUAL LANE: 3 kg
Top Clearance40 mm
Bottom Clearance40 mm
Edge Clearance3 mm
Conveyor Height880 – 920 mm

* SMEMA Compatible

Inspection Functions

DefectsInsufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging
MeasurementHeight
Area
Volume
Offset

产品详情

德律TR7007SII介绍:

TR7007 SII是产业最快速的锡膏印刷检测机,检测速度高达200 cm2/sec。高精度在线型无阴影的锡膏印刷检测解决方案提供全3D检测,分辨率包含15 µm or 10 µm并具备高精度线型马达平台。此系统的特点包括closed loop function、强化的2D成像技术、自动板弯补偿功能与条纹光扫描技术。此系列亦有双轨架构之机型,在不增加机台落地空间下,大幅提升了生产线的产能。

德律TR7007SII特性:

1. 业界最快速的锡膏印刷检测机

2. 无阴影条纹光检测技术

3.光学分辨率提供10 µm 及 15 µm 两种选择

4. X-Y table线性马达可提供无震动精确检测

德律TR7007SII规格:

Optical System

Imaging MethodDynamic Imaging
Camera4 Mpix
Imaging Resolution10 µm or 15 µm (factory setting)
LightingRGB LED
3D Technology2-way Digital Fringe Pattern
Field of View4 Mpix@ 10 µm: 20 x 20 mm
4 Mpix@ 15 µm: 30 x 30 mm

Inspection Performance

Imaging Speed4 Mpix@ 10 µm: 90 cm²/sec
4 Mpix@ 15 µm: 200 cm²/sec
Height Resolution0.4 µm
Max. Solder Height@ 10 µm: 420 µm
@ 15 µm: 385 µm

Motion Table & Control

X-Axis ControlLinear Motor and linear scale with DSP-based controller
Y-Axis ControlBallscrew + AC-servo controller
Z-Axis ControlBallscrew + AC-servo controller
X-Y Axis Resolution0.5 µm
Z-Axis Resolution1 µm

Board Handling

Max PCB SizeTR7007 SII: 510 x 460 mm*
TR7007L SII: 660 x 610 mm
TR7007LL SII: 850 x 610 mm
TR7007 SII DUAL LANE: 510 x 310 mm

*Board Size TR7007L SII: 50 x 50 - 660 x 610 mm (1.97 x 1.97 - 26.0 x 24.0 in) [optional]
TR7007LL SII: 50 x 50 - 850 x 610 mm (1.97 x 1.97 - 33.5 x 24.0 in) [optional]
PCB Thickness0.6-5 mm
Max PCB WeightTR7007 SII: 3 kg
TR7007L SII: 5 kg
TR7007LL SII: 5 kg
TR7007 SII DUAL LANE: 3 kg
Top Clearance40 mm
Bottom Clearance40 mm
Edge Clearance3 mm
Conveyor Height880 – 920 mm

* SMEMA Compatible

Inspection Functions

DefectsInsufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging
MeasurementHeight
Area
Volume
Offset

Dimensions

成功案例

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