TR7007SII /TR7007SIIPLUS 3D SPI 九成新
德律TR7007SII介绍:
TR7007 SII是产业最快速的锡膏印刷检测机,检测速度高达200 cm2/sec。高精度在线型无阴影的锡膏印刷检测解决方案提供全3D检测,分辨率包含15 µm or 10 µm并具备高精度线型马达平台。此系统的特点包括closed loop function、强化的2D成像技术、自动板弯补偿功能与条纹光扫描技术。此系列亦有双轨架构之机型,在不增加机台落地空间下,大幅提升了生产线的产能。
德律TR7007SII特性:
1. 业界最快速的锡膏印刷检测机
2. 无阴影条纹光检测技术
3.光学分辨率提供10 µm 及 15 µm 两种选择
4. X-Y table线性马达可提供无震动精确检测
德律TR7007SII规格:
Imaging Method | Dynamic Imaging |
Camera | 4 Mpix |
Imaging Resolution | 10 µm or 15 µm (factory setting) |
Lighting | RGB LED |
3D Technology | 2-way Digital Fringe Pattern |
Field of View | 4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm |
Imaging Speed | 4 Mpix@ 10 µm: 90 cm²/sec 4 Mpix@ 15 µm: 200 cm²/sec |
Height Resolution | 0.4 µm |
Max. Solder Height | @ 10 µm: 420 µm @ 15 µm: 385 µm |
X-Axis Control | Linear Motor and linear scale with DSP-based controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | Ballscrew + AC-servo controller |
X-Y Axis Resolution | 0.5 µm |
Z-Axis Resolution | 1 µm |
Max PCB Size | TR7007 SII: 510 x 460 mm* TR7007L SII: 660 x 610 mm TR7007LL SII: 850 x 610 mm TR7007 SII DUAL LANE: 510 x 310 mm *Board Size TR7007L SII: 50 x 50 - 660 x 610 mm (1.97 x 1.97 - 26.0 x 24.0 in) [optional] TR7007LL SII: 50 x 50 - 850 x 610 mm (1.97 x 1.97 - 33.5 x 24.0 in) [optional] |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | TR7007 SII: 3 kg TR7007L SII: 5 kg TR7007LL SII: 5 kg TR7007 SII DUAL LANE: 3 kg |
Top Clearance | 40 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm |
Conveyor Height | 880 – 920 mm * SMEMA Compatible |
Defects | Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
Measurement | Height Area Volume Offset |
德律TR7007SII介绍:
TR7007 SII是产业最快速的锡膏印刷检测机,检测速度高达200 cm2/sec。高精度在线型无阴影的锡膏印刷检测解决方案提供全3D检测,分辨率包含15 µm or 10 µm并具备高精度线型马达平台。此系统的特点包括closed loop function、强化的2D成像技术、自动板弯补偿功能与条纹光扫描技术。此系列亦有双轨架构之机型,在不增加机台落地空间下,大幅提升了生产线的产能。
德律TR7007SII特性:
1. 业界最快速的锡膏印刷检测机
2. 无阴影条纹光检测技术
3.光学分辨率提供10 µm 及 15 µm 两种选择
4. X-Y table线性马达可提供无震动精确检测
德律TR7007SII规格:
Imaging Method | Dynamic Imaging |
Camera | 4 Mpix |
Imaging Resolution | 10 µm or 15 µm (factory setting) |
Lighting | RGB LED |
3D Technology | 2-way Digital Fringe Pattern |
Field of View | 4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm |
Imaging Speed | 4 Mpix@ 10 µm: 90 cm²/sec 4 Mpix@ 15 µm: 200 cm²/sec |
Height Resolution | 0.4 µm |
Max. Solder Height | @ 10 µm: 420 µm @ 15 µm: 385 µm |
X-Axis Control | Linear Motor and linear scale with DSP-based controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | Ballscrew + AC-servo controller |
X-Y Axis Resolution | 0.5 µm |
Z-Axis Resolution | 1 µm |
Max PCB Size | TR7007 SII: 510 x 460 mm* TR7007L SII: 660 x 610 mm TR7007LL SII: 850 x 610 mm TR7007 SII DUAL LANE: 510 x 310 mm *Board Size TR7007L SII: 50 x 50 - 660 x 610 mm (1.97 x 1.97 - 26.0 x 24.0 in) [optional] TR7007LL SII: 50 x 50 - 850 x 610 mm (1.97 x 1.97 - 33.5 x 24.0 in) [optional] |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | TR7007 SII: 3 kg TR7007L SII: 5 kg TR7007LL SII: 5 kg TR7007 SII DUAL LANE: 3 kg |
Top Clearance | 40 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm |
Conveyor Height | 880 – 920 mm * SMEMA Compatible |
Defects | Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
Measurement | Height Area Volume Offset |